Systems Thermal Engineer Job at TPI Global Solutions, Austin, TX

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  • TPI Global Solutions
  • Austin, TX

Job Description

Title: Systems Thermal Engineer

Duration: 12+ months

Pay Rate : $29.40-$47.41/Hour

Location: Austin Texas

The Role

  • Seeking a Thermal Engineer Contractor to join our cross-functional team working on the co-development of consumer and commercial notebook products.
  • The candidate will be responsible of testing, evaluating, and reporting the thermals, skin temperatures and acoustics of systems.
  • As part of the extended responsibilities, the candidate will also report power and performance results and interact with feature development teams, validation teams, power and performance teams, as well as evaluating competitor systems generating competitive analysis reports.

The Person

  • The candidate should have background in thermal management, computer system architecture (notebooks preferred), ergonomics and acoustic standards .

Key Responsibilities

  • Thermal design, modeling, testing, and debug of mobile products.
  • Expertise in thermal, power and performance tradeoffs and resulting impacts to delivered product competitiveness, user experiences and best battery runtime.
  • Work across client and graphics engineering teams to ensure delivery of class-leading products.
  • Understand power, performance, and thermal issues and interactions at system and/or silicon level. Able to quickly identify issues and drive alternate solutions.
  • Continuously investigating and enabling ways to increase process efficiency
  • Significant lab experience required and should include scripting and/or programming for testing automation, system setup, instrumentation, testing and teardown.

Preferred Experience

  • Detailed understanding of PC system architecture, mobile system mechanical, board design, and power delivery.
  • Experience with design for ergonomics – skin temperature, acoustic, performance and battery life optimization
  • Direct technical experience on APU/CPU system performance analysis
  • Understand APU architecture and thermal controls .
  • Knowledge of Firmware controlled system power and thermal management requirements and features.
  • Experience with system layout optimization, chassis design, and thermal solution sizing to meet performance and sizing requirements.
  • Must have deep knowledge of all key system thermal components and new technologies including fans, heatsinks, shielding, spreaders, Thermal Interface Materials .
  • System knowledge of all key components and sub-systems which impact thermals (VRAM, NVME, VR, Memory, Charging circuit, etc).
  • Effective with communication and building respect while communicating status to executive level audience
  • Expert knowledge in heat transfer and fluid mechanics with advanced level experience in system CFD modeling using Icepak or Flotherm. Mechanical CAD modeling with Creo or Solidworks also desired

Essential skills: Thermal design experience, lab hands-on experience instrumenting systems and conducting tests, understanding of PC system architecture

Nice-to-have: Understanding of power and performance, knowledge of thermal components and technologies and CFD modeling

Academic Credentials

  • Bachelor’s Degree (BS) in Mechanical Engineering or other relevant discipline plus minimum of 1-2 years of experience (3-4 years max) in computer systems thermal/power/performance design required

Job Tags

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