Semiconductor Packaging Design Engineer Job at TPI Global Solutions, Alameda, CA

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  • TPI Global Solutions
  • Alameda, CA

Job Description

Job Title: Semiconductor Packaging Design Engineer

Location: Sunnyvale-Remote

Duration: 12+ months

Responsibilities:

  • Design of semiconductor packages and modules for AR/VR Silicon.
  • Design feasibility studies based on electrical performance and form factor requirements.
  • Support electrical extraction and SI/PI/PDN analysis on the package design.
  • Ideation of new architecture/ design concepts such as Client interfaces for Sensor-Compute etc

Skills:

  • Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
  • Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
  • Familiarity with image sensors and camera modules would be a plus
  • 7-10 years’ of experience in hands-on Package/Module/PCB design
  • BS/MS/equivalent experience in engineering; PhD preferred

Tools to know:

  • Cadence (APD/PCB Designer/OrCAD)
  • Mentor (Hyperlynx/Expidition)
  • HFSS
  • ANSYS
  • Signal Integrity

Job Tags

Remote job,

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