The requirement as follows
Job title: Packaging Engineer
Duration: 12+ months
Location: REMOTE
Skills:
• Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
• Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
• Familiarity with image sensors and camera modules would be a plus
• 7-10 years’ of experience in hands-on Package/Module/PCB design
• BS/MS/equivalent experience in engineering; PhD preferred
Tools to know:
1. Cadence (APD/PCB Designer/OrCAD)
2. Mentor (Hyperlynx/Expidition)
3. HFSS
4. ANSYS
5. Sigrity
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