***No C2C or 3rd Party Candidates will be accepted
***Must currently reside in or near Sunnyvale, CA to be considered
Job Title: Hardware Design Engineer
Location: Sunnyvale-Remote
Responsibilities:
• Design of semiconductor packages and modules for AR/VR Silicon.
• Design feasibility studies based on electrical performance and form factor requirements.
• Support electrical extraction and SI/PI/PDN analysis on the package design.
• Ideation of new architecture/ design concepts such as novel interfaces for Sensor-Compute etc
Skills:
• Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
• Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
• Familiarity with image sensors and camera modules would be a plus
• 7-10 years’ of experience in hands-on Package/Module/PCB design
• BS/MS/equivalent experience in engineering; PhD preferred
Tools to know:
1. Cadence (APD/PCB Designer/OrCAD)
2. Mentor (Hyperlynx/Expidition)
3. HFSS
4. ANSYS
5. Signal Integrity
Education: Bachelors degree
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